"Will accelerate innovation, generate employment": Odisha CM Majhi welcomes Cabinet approval of semiconductor projects

Bhubaneshwar (Odisha) [India], August 12 : Expressing gratitude to the Centre over the approval of the semiconductor manufacturing unit in Odisha, Chief Minister Mohan Charan Majhi on Tuesday said that this move will accelerate innovation, generate employment, and strengthen the state's position as a vital contributor towards the vision of Atmanirbhar Bharat.
The Union Cabinet, chaired by Prime Minister Narendra Modi, approved four more semiconductor projects under the India Semiconductor Mission (ISM) in Odisha, Punjab and Andhra Pradesh with an outlay of Rs 4600 crore.
In a post on X, Odisha CM said, "I sincerely express my gratitude to Hon'ble Prime Minister Narendra Modi and Union Minister Ashwini Vaishnaw for the Central Cabinet's approval of the establishment of two semiconductor manufacturing units in Odisha."
"The recent amendment of the Odisha Semiconductor Manufacturing and Fabless Policy, aimed at enhancing investment viability, competitiveness, and sustainability, together with this significant Cabinet approval, marks a major milestone in the state's industrial and technological advancement. This collaborative effort will accelerate innovation, generate employment, and strengthen Odisha's position as a vital contributor towards the vision of Atmanirbhar Bharat.," he added.
As per the release issued by Union Cabinet, 3D Glass Solutions Inc. (3DGS) will be setting up a vertically integrated advanced packaging and embedded glass substrate unit in Info Valley, Bhubaneshwar, Odisha. "This unit will bring world's most advanced packaging technology to India," it stated.
The release further mentioned that SicSem Private Limited is collaborating with Clas-SiC Wafer Fab Ltd., UK, to establish an integrated facility of Silicon Carbide (SiC) based Compound Semiconductors in Info Valley, Bhubaneshwar, Odisha. "This will be 1st commercial compound fab in the country."
The project proposes to manufacture Silicon Carbide devices. This compound semiconductor fab will have an annual capacity of 60,000 wafers and packaging capacity of 96 million units. The proposed products will have applications in Missiles, Defence equipment, Electric Vehicles (EVs), Railway, Fast Chargers, Data Centre racks, Consumer Appliances, and Solar Power Inverters.