Foundation stone laid for India's first advanced 3D chip packaging unit in Odisha's Info Valley

Apr 19, 2026

Union Minister for Electronics & IT Ashwini Vaishnaw said that the foundation stone of a semiconductor plant has been laid in Odisha on the...

Odisha breaks ground on 3D Glass Solutions advanced glass chip packaging unit; State eyes top-tier semiconductor hub status

Apr 19, 2026

Odisha took a major leap into the global semiconductor value chain on Sunday as Chief Minister Mohan Charan Majhi performed the groundbreaking for 3D...

3D Glass Solutions to invest Rs 1,943 crore in Odisha for advanced chip packaging facility; Targets 2030 production

Apr 19, 2026

3D Glass Solutions Inc (3DGS), USA, through its wholly owned Indian subsidiary Heterogenous Integration Packaging Solutions Pvt Ltd (HIPSPL), is implementing a greenfield, vertically...

LG Chem develops key liquid material for advanced chip packaging

Sep 29, 2025

South Korea's LG Chem Ltd. said on Monday it has developed a liquid photo-imageable dielectric (PID), a key insulating material for advanced semiconductor packaging....

izmo Microsystems Partners with IIT Madras for Cutting-Edge Photonic Chip Packaging Solutions

Mar 26, 2025

Bangalore (Karnataka) [India], March 26: izmo Microsystems, a division of izmo Ltd. (NSE: IZMO) is proud to announce its role as the exclusive industry...

LG Electronics accelerates return to semiconductor sector

Sep 17, 2025

LG Electronics is ramping up efforts to commercialize semiconductor equipment for high-bandwidth memory (HBM) as demand for chip packaging tools surges with the spread...