Union Minister Ashwini Vaishnaw calls 3DGS semiconductor plant foundation in Odisha a "historic day", says state emerging as "IT hub"

Apr 19, 2026

Speaking to ANI, the Union Minister highlighted Odisha's rapid industrial transformation, stating, "It is indeed a very important day, a historical day today for...

Odisha breaks ground on 3D Glass Solutions advanced glass chip packaging unit; State eyes top-tier semiconductor hub status

Apr 19, 2026

Odisha took a major leap into the global semiconductor value chain on Sunday as Chief Minister Mohan Charan Majhi performed the groundbreaking for 3D...

3D Glass Solutions to invest Rs 1,943 crore in Odisha for advanced chip packaging facility; Targets 2030 production

Apr 19, 2026

3D Glass Solutions Inc (3DGS), USA, through its wholly owned Indian subsidiary Heterogenous Integration Packaging Solutions Pvt Ltd (HIPSPL), is implementing a greenfield, vertically...