SK hynix and Naver ink MoU on next-gen AI memory solutions

Sep 10, 2025

SK hynix Inc. and Naver Cloud Corp. have signed a memorandum of understanding (MoU) to jointly develop next-generation AI memory solutions, described as the...

Samsung Electronics to expand AI-equipped products with 'Memory Super Gap' strategy

Aug 25, 2021

Seoul [South Korea], August 25 (ANI/Global Economic): Samsung Electronics is going to expand memory semiconductor product line equipped with artificial intelligence (AI) engines by...

AI can beat human brain in chess, but not in memory, reveals study

Jan 18, 2021

Oslo [Norway], January 19 : A new research has shown that the brain strategy for storing memories is more efficient than that of Artificial...

LG Electronics dives into semiconductor equipment, developing HBM chip for AI applications

Jul 29, 2025

LG Electronics is making a strategic push into the semiconductor equipment sector, focusing on building key machinery for producing high-bandwidth memory (HBM) chips essential...

Samsung's visit to Nvidia brings new hope for high bandwidth memory chips business

Jul 02, 2025

Samsung Electronics' Vice Chair Jun Young-hyun recently visited Nvidia in Silicon Valley, raising hopes that the company could soon supply its latest high-bandwidth memory...

Pune-based DATASMITH AI Announces Strategic MoU with TCS Pace, Netherlands; Introduces TenderGenie for Human-Centric Tender and RFP Decision Intelligence

Jan 30, 2026

Pune (Maharashtra) [India], January 30: DATASMITH AI, a Pune-based enterprise AI company, has announced a strategic Memorandum of Understanding (MoU) with TCS Pace, Netherlands,...